ASAT Holdings Ltd. announced it has reached the 20-year landmark as a company providing semiconductor package design, assembly and test services.
“From the beginning of our existence, ASAT focused on being an advocate for the semiconductor packaging, assembly and test technologies industry,” said Tung Lok Li, acting CEO of ASAT. “Looking ahead, we remain committed to our corporate legacy of providing our customers with the service and solutions they require for another 20 years and beyond.”
ASAT has been an industry innovator for the semiconductor packaging and assembly market. This includes being the first to introduce the Leadless Plastic Chip Carrier, the industry’s first QFN (Quad Flat No-Lead), in 1998, as well as the Thin Array Plastic Package in 2000.
“I firmly believe the next few years will be the most exciting time in our history for ASAT’s customers and employees,” said Jeff Osmun, ASAT President. “All of our core capabilities and competencies fit in perfectly with the needs of our customers presently and in the coming years. We have a great opportunity to blend the best of our past with our vision for the future.”
China-based ASAT manufactures standard and thermally-enhanced leaded packages, chipscale packages, standard and high thermal performance ball grid arrays, leadless plastic chip carriers, thin-array plastic packages, system-in-package, stacked die, and flip chip packaging.
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